Vowed not to give up: Intel next-generation Itanium introduced Hyper-Threading-Intel,Poulson, Itanium, Kittson
Despite Oracle\'s ruthless betrayal, HP number one partner in a big trouble, but Intel is clearly not going to give up Itanium (Itanium), Hot-Chips 23, held recently at Stanford University on a high performance processor Assembly once again about the next generation of “
Poulson”。 According to the latest Intel information announced, Poulson Itanium will be released in 2012, manufactured using 32nm process, up to eight core, 12-wide emission structure, and was first introduced to support Hyper-Threading technology, and which can provide up to 16 logical thread. This technique has a long history in the desktop and server processors, but it is the first time upon the Itanium.
Intel Itanium 2 times was once intended to have it support hyper-threading, but eventually cancelled.
According to previously published data, Poulson Itanium will integrate approximately 3.1 billion transistors, core area fell to 544 sq mm, thermal design power remain 170W, cache level 16+16KB, two 512+256KB, three-level 32MB.
Wynca Teng also supports “ directive replay technology ” (Instruction Replay Technology) to help in detecting errors in the operation, and also supports four different areas of the new directive: integer operations (Integer Operations), data access prompts (Data Access Hints), extended software prefetch (Expanded Software Prefetch), line-programmed (Thread Control). Intel also stress once again that Poulson will have next-generation Itanium “
Kittson”, currently under development, but many people think that it will become the end curved of the Itanium. First Memorial Auditorium at Stanford University of antique beauty: IBM, Intel, AMD (bulldozer), high-performance processor plan ARM ARM to discuss here the superphone conception
Approximation 6.5GHz-bulldozer bulldozer samples in liquid nitrogen overclocking, liquid nitrogen, overclocking, 6.5GHz
OBR Blog today released a video blog website, demonstrates AMD bulldozer processor engineering sample in liquid nitrogen overclocking ability, approximation of 6.5GHz is quite to the force. Seen from the video, test this bulldozer was used in early engineering samples, presumably stepping version B0 and B1.
Liquid nitrogen Cannon about processor temperature dropped to-185 ° c under the repression, shows up to 6483MHz when the system startup, after entering the system is 6.43GHz, FSB 30.5x 211MHz, multiplier, core voltage exceeds 2.0V, Northbridge voltage higher than 1.5V.
It was also tested, high pressure and low temperature overclocking potential is very good for this sample, the voltage has been added to the 2.1V, frequencies also rise all the way, another-this ultra-low temperature of 180 ° c,-190 degrees Celsius did not touch the Cold Bug.
But because the early samples of sake, even if Super-to more than 6.4GHz are not very well.
OBR Blog once the bulldozers in the wind before Super 4.6GHz in cold conditions, Taiwan Cangzhou limit also ran out of 6GHz results of liquid nitrogen, and according to the news, liquid nitrogen overclocking AMD will show in the near future bulldozer and special skills, bulldozers will inherit the traditional of Phenom II, ultimate overclocking to the end. Overclocking platform: Formula motherboard is ASUS CrossHair v-185 power 6483MHz power 6483MHz ASUS overclocking platform Turbo EVO tools interface: 6.4GHz eight-core running at full speed running SuperPI, 2.1V 1M (unpublished) only one core running in 100%
APU can drive video cards? Athlon II landing stores-AMD,APU,Athlon II X4 631 X4 631
APU for a very special product launch today, that is the Athlon II X4 631 processor.
Say it, as compared with the AM3 Athlon II product, PCI-E 2 controller and its integration with Socket FM1 and compared with normal FM1 Llano APU, its internal GPU is blocked. Athlon II X4 similar Athlon II X4 630 and 631 processor specifications, can also be seen as masking the GPU A6-3650.
Default frequency 2.6GHz Athlon II X4 631, L2 cache configured with 4MB, DDR3-1866 integration within the memory controller and PCI-e 2 controllers, do not support Turbo Core technology, TDP to 100W, 5W per cent higher than the Athlon II X4 630, given its “ and integrated North Bridge ” practice, this cost is also acceptable. In addition, AMD established practice, the emasculated version of APU GPU shield is likely only through logical manner, rather than on the physical castration, so we are likely to support “ open nuclear ” opens in the APU motherboard GPU by shielding. Before being confirmed, of course, we still cannot rule out the GPU is shielded by physical means.
According to our preliminary tests, the CPU performance and A6-3650 is “ infinitely close to ”. At present the special APU has appeared on the market, priced at RMB $ 599, codeine A55/A75 distribution Board, the APU is also a lot cheaper than ordinary. If the GPU Athlon II X4 631 can open the shield, then it is also quite good on the price/performance. (Text/Super network)
AMD is a portable, ultra thin and light notebook, one, and the desktop to launch the upgrade version of the AMD Fusion APU-AMD,Fusion,APU,E-450,E-300,C-60
On August 22, 2011, —&mdash of Sunnyvale, California; AMD Corporation (NYSE:AMD) today announced that its award-winning series c and e to speed up the processor (APU) was upgraded to meet super thin, small value performance notebook, HD, one and the desktop computer\'s performance needs. APU will bring to users of the latest upgrade: &Bull;
More HD graphics capabilities; •
Enhanced memory brings higher performance; • Support DisplayPort++ can be connected to any monitor or TV with HDMI or DisplayPort connection; &Bull;
Based on mobile platform on a single charge of APU can achieve up to 12 hours of battery standby time —— 4 hour increase over the previous generation platforms.
With immediate effect, leading manufacturers will adopt a new generation of APU launched new notebooks in the market-oriented, small, small form factor desktop and one HD machine. AMD Vice President and end product manager Chris Cloran stated: “ today\'s computer users want to PC with outstanding HD image processing capabilities, and accelerate performance, while realizing all day battery life, these requirements and experience with AMD Fusion APU brings coincide. New APU will bring better performance to entry-level products, so that users have a better computing experience.
” AMD currently has 12 million shipment an APU, only in the second quarter of 2011, c and e series APU to hot to ship more than 5 million.
AMD launched the enhanced version of the c and e series DirectX®11 single core of APU, through strong and parallel-processing engine to address high on smooth eye movement of media video, sharp pictures and lifelike game experience requirements, while enabling all day battery life. Upgraded version of the APU of the new features also include: &Bull; Support for DDR3 1333 technology: by upgrading the memory bandwidth to bring faster transfer speeds, while also enabling faster video playback; &Bull;
Support HDMI 1.4A interface: users can watch on your TV or monitor to support 3D display 3D images and video; AMD new c-series and e series APU to provide mobile users with longer battery life than in the past ——
E-series standby time up to 10.5 hours and the c series of up to 12 hours, —— enables users to work and entertainment for a long time without finding a power outlet.
By the next generation of leading computer manufacturers products APU will be on sale starting from today, AMD VISION allows users to identify or recognize HD Internet identity. More information: § To learn more about recent AMD Fusion News, check out http://blogs.AMD.com/fusion/§ To learn more details of the AMD Fusion APU, please visit AMD Fusion website § Also enables the VISION technology under the Web site to help you select a computer
AMD low-power APU fire three brought DDR3-1333, HDMI 1.4a-Brazos,APU,E-450,E-300,C-60,DDR3-1333,HDMI 1.4A
For the mainstream market increase Llano APU-a series of new models after, APU Brazos E/C series ultra-low power consumption also welcome three new members today, can be used for laptops, ultra thin and light laptops, netbooks (small HD), one machine, desktop, desktop, and other fields.
This Muscovy publishing of three paragraph new model respectively for E-450, and E-300, and C-60, all are is double core, compared has has model main is to has more high of processor, and memory and graphics core frequency, which memory frequency all from DDR3-1066 upgrade to DDR3-1333, memory bandwidth natural more high, while AMD claimed c, and e series mobile platform of standby cruising time most long respectively can up 12 hours, and 10.5 hours.
Video output connection, is supported by three new APU DisplayPort++HDMI 1.4A, former APU can interface with any HDMI, DisplayPort display devices connected to the, which used to connect any 3D stereo TV or monitor to enjoy 3D stereoscopic pictures, videos. E-450: dual-core clock speed 1.65GHz, integrated graphics core Radeon HD 6,320, 80 stream processors, frequency 600MHz thermal design power 18W.
(Frequency of E-350 for 1.6GHz/508MHz) E-300: dual-core clock speed 1.3GHz, integrated graphics core Radeon HD 6,310, 80 stream processors, frequency 488MHz thermal design power 18W.
C-60: dual-core, dynamic accelerated the highest clock speed 1.0GHz,Turbo Core 1.3GHz core integrated graphics Radeon HD 6,290, dynamic accelerated the highest frequency 276MHz,Turbo Core 400MHz, thermal design power consumption 9 w. E-450, E-300, C-60 have been to the OEM manufacturer to ship, and related products currently are also listed.
In fact before we have seen a variety of notebook equipped with three new APU.
AMD also announced the Fusion of APU processor cumulative shipments of more than 12 million, of which E/C series has sold more than 5 million in the second quarter. Optional E-450, C60 APU ASUS K53BY
Qualcomm not hide behind the wish to make a new Intel-for Qualcomm, Intel,Snapdragon
It is no longer a live royalties company, is no longer a mere chip producer, even hiding behind no longer suffice.
It seems to have become Intel. &Amp;ldquo;Intel Inside” this tag, is probably the most important product recognized Slogan (slogans), it makes an ordinary consumers do not see the product turned into a public brand, and it has also obtained additional professional mystery. &Amp;ldquo;: is Intel CPU?
&Amp;rdquo; when purchasing a computer, people tend to ask for a sentence to look himself not so easy to fool. But few consumers know what CPU is about, this is not important.
This is the brand. Now another Qualcomm chip manufacturer is planning to repeat the story. It won\'t be long before, part of the new factory of Motorola, HTC, Huawei and ZTE Smartphone on the back, was beaten to the last “
Powered by Snapdragon” the new identity. If you are using a Smartphone, that almost half of may, you are accepting it “ power ”.
By virtue of a series of Snapdragon processor products, high-throughput occupy CPU smartphone market share of more than 40%, become the supplier of almost half Tablet microprocessor, also entered the field of wireless medical and Imaging. Just as with Intel, you don\'t have to know what is in it.
You think about it, all you\'ve done on the computer on this small chip on completion of an action. Now Qualcomm processor technology and the Internet service of income is the total income of 65%, which made it out of the erstwhile “ patent collector ” image.
Qualcomm recently by 2011 fiscal year revenue expectations to $ 15 billion — compared to Intel it is still just a fraction, but its market value has exceeded $ 100 billion, among which Intel “ billions of Club ” camp, if it was just a patent fees and living on traditional communications chip company, investors have no reason to give it such high expectations. Recently, Qualcomm is a Snapdragon chip integrated into more functional modules, Qualcomm now has a Snapdragon chip integration of 3G network, Flash video player, Bluetooth, Wi-Fi network communications, a short distance perception (NFC) and many functional modules.
In the next generation in Snapdragon, Qualcomm will also get gesture-aware technology and recent acquisitions of today\'s most popular “ ar ” technology integrated in. Qualcomm wanted something can also be the same with Android to be selected. It wishes to “ Snapdragon” buy smart phones and tablets become the public decision-making brand, inscribed on every device, appeared in various forms of digital advertising. Since then people buy smart phones is not too concerned about them are Motorola, HTC is also produced, and more concerned about “ if &rdquo the Android operating system;, Qualcomm believes, people have every reason to judge whether a Smartphone worthy of income when SAC, ask “ is a Snapdragon processor ” or “
Which version of Snapdragon ”. Qualcomm does not want to continue to become a chip manufacturer that only provide communication technology standards and franchises for sale. Paul · James became CEO three years later, he began to carry out the plan.
It should be said that Snapdragon Qualcomm in recent years the most successful strategies, even in recent years high pass in the next-generation communications standard LTE technology is also quite a number of breakthroughs and accumulation, but the Snapdragon reflects Paul · under Jacob Qualcomm some attempt to go beyond past boundaries. Paul\'s father Frank Ervin · when Jacob was in place, those once-frequent communications associate with it peers tend to describe as a haughty, difficult to deal with Qualcomm also had to touch the object. Early research and development of reserves have it mastered the technology of CDMA patents, and later become the owner of most WCDMA patents. Current worldwide has more than 2,000,000,003 g users, 90% 3G of patents are associated with high-throughput wireless communication technology, almost every 3G has to pay the Qualcomm “ fare ”.
Qualcomm headquarters in San Diego there is a famous “ patent wall ” (Patent Wall), numerous records of this company founded in 1985 to date have all of the inventor of the patent assets and their names. This is the Qualcomm proud “ intellectual assets ”, is also a nightmare for many chips peers and even handset makers. Qualcomm lawyers employs a huge team, with the wireless Chipmakers Texas instruments (TI), Broadcom (Broadcom), as well as rivals such as Nokia and Ericsson war broke out the marathon legal battle, demanding royalties to them. &Amp;ldquo; those companies trying to change our business model, but they eventually gave up, ” Paul · James said in an interview, “ no one willing to pay money to others, it is human nature, but when you use intellectual property rights of others when you have to do. ” Paul · 6 years ago from his father Jacob Frank Ervin · Jacob took over for Qualcomm CEO moves on the wand, 3 years ago and took over as Chairman of the Board. On the defense of patent rights, he inherited his father\'s hard-line faction, but he and his father it is almost the only intersection of, otherwise, “
Powered by Snapdragon” the identity there may not be on the phone —— it and patent costs a relationship there. Snapdragon Qualcomm introduced by the end of 2007 a chip. If 3G baseband communications chips (Baseband Chipset) of chromosomes as a Smartphone, chip (CPU) is like the heart of the smart phone.
The former determines the standard for a mobile communication standard used, which determines how fast the speed of the mobile phone opens a browser and play when the angry bird will jams, and these elements are increasingly becoming a Smartphone can win the key. But then it\'s also very inconspicuous.
Then Qualcomm eagerly claimed Snapdragon smartphones are more terminal equipment used outside, but in February 2008 but people found it to be used in a fairly mediocre in the Toshiba TG01 Smartphone. When Intel leading the rise of netbooks, Qualcomm has tried to redefine a built-in 3G network module, connected to the Internet at any time and with lower power consumption do not need a fan of new computing devices, and call it “ intelligent ”, where with the Snapdragon processor.
But pan over netbooks, intelligent yet popular will has petered out. But Qualcomm and unwilling to admit this is a failure. &Amp;ldquo; through the intelligent attempt at this, we are familiar with IT eco-system partners, also proved the Snapdragon computing capacity and power consumption itself is that they need, they are willing to accept us.
&Amp;rdquo; Qualcomm global Executive Vice President and Group President Steve CDMA technology · molunkefu (Steve Mollenkopf) said. In fact, Qualcomm processor implementation of great breakthrough.
Snapdragon in computing performance and power balance cater to a Tablet for thin and light and thermal-power requirements, and even, no even fan. To be even, it inspired the emergence of Tablet PC development. Although Apple use it, but the Snapdragon commercial encounters the rise of the Android platform. In September 2008, the world\'s first Android Smartphone HTC Dream is a Qualcomm Snapdragon chip, all after the HTC Android smartphones are used Snapdragon CPU. Due to the Android platform stresses and Internet “ seamlessly integrated ” experience of even greater importance to operational performance of the processor, which Qualcomm Snapdragon series more closely associated with the Android phone.
Now, high-throughput CPU smartphone market share of more than 40%, and in the world\'s first operating system Android market, its share even more than the 60%. Rival Intel nor used by Apple.
Panoramic view of the tablet computer market in the world, only 10% of the product using the Intel Atom based on X86 (Atom) processors, in 90% of the ARM architecture in tablet, Snapdragon share nearly half. It tasted Intel sweeteners, it now has more and more like Intel.
Even copying the Intel chip product naming rule, abandoned the engineer loves Snapdragon MSM8255 complex number system, but instead they reduced to the simplest S1, S2, S3 and S4. Continue to >> next [1th page [2nd page] [next page] click on this page to read the full text
Bulldozer core area is officially mentioned for the first time in public FX-8150-AMD, the bulldozer, Bulldozer, core area, FX-8150
In California, which at the annual symposium on high performance processor Hot-Chips 23, IBM, Intel, AMD, and other big Giants have not announced a new product or technology, but continued to turn out the same old story for publicizing and “ sermon ”,AMD the focus of course is the “ bulldozer ”. Bulldozer core schema map we\'ve seen it many times, but this is from AMD official, detailed annotations module name and the relative sizes are rare, and it publicly for the first time in the bulldozer processor core area: 315 sq mm eight-core model.
As a comparison, 240 square mm 32nm Gulftown six-core 32nm Sandy Bridge two hundred and sixteen-one hundred and forty nineths mm square quad/dual-core 45nm Phenom II X6/X4 three hundred and forty six-two hundred and fifty eighths mm square respectively. From the figure you can clearly see on Dozer\'s four modules (eight core), four groups of 2MB secondary cache, four groups of four 2MB three-level cache, HT bus bridges module, DDR3 memory controller, I/O input/output, and so on.
Six-core and quad-core model is based on the shield part of the module (core) and caching.
Introduction to the composition of a picture frame and structure characteristics: bulldozer family number for the Family of 15h, is the first new design since the AMD K8 Processor architecture, greatest feature is that each core plus a float two whole core to form a module for resource sharing. Bulldozer each core has its own associated 16KB 4-channel-level cache, each module has its own associated 2MB 16-channel secondary cache (two cores share), and then all of the modules associated with shared core 8MB 16 up to road level three cache.
Three levels of cache cache line (cacheline) is 64 bytes. Another bulldozer processor also integrates two 72-bit DDR3-1866 memory controller channel, and received four 16-bit, and 16-bit launch HyperTransport bus links.
Bulldozer processor Socket AM3+ the desktop version of Zambeizi will be converted to the new interface to support low-voltage memory, increases to a maximum of 2.0A of ILDT current, so as to enhance the HT bus speed to a maximum of 5.2GT/s,IDDR currents also increased to a maximum of 4.0A.
Bulldozers will mainly used with 990FX, 990X, 970 SB950 and Northbridge Southbridge chip, theoretically also backward compatible with the 8-series chipset, but a reform of the old Board need hardware or BIOS refresh only, and may not be able to play a full strength of the bulldozer. Socket AM3+ socket with backward compatibility, the new Board can still install a Socket AM3 Phenom processor II/Athlon II series, but not vice versa, that is, the AM3 socket motherboard AM3+ bulldozer processors cannot be used.
Bulldozer architecture first idea is that each module is comprised of two core, data cache for the integer pipeline, level, and so on respectively to be implemented, while for floating-point pipeline, the second-level cache is shared by two core work.
AMD said that this approach enables each core when required to complete more features, more performance, while saving the core area, higher than the efficiency of each core individually separated. Bottom bulldozer specific composition of each module, front end of the first two core shared two separate integer core continues to >> next [1th page [2nd page] [next page] click on this page to read the full text
New patch improved Intel processor for Windows 7-Windows 7 stability, microcode, Intel, processor, stability, Merom,Penryn,KB2493989
Microsoft today released a hot fix patch KB2493989, a microcode update for the Intel processor (microcode update), used to improve the stability of a specific model.
In the Microsoft Knowledge Base article says, in part on the type of Intel processor, 64-bit version of Windows 7, Windows Server 2008 R2 systems some features may not work properly, either RTM version or SP1 version is true. But Microsoft stressed that this is not a universal phenomenon, but is limited to code-named Merom, the Intel Penryn Core, Xeon series, which is the first generation of 65nm process technology and next-generation 45nm Core Framework products, also affected the processor Stepping (walking) values for 6,Model (model) values of 15, 22, 23 or 29.
These property values can be viewed through CPU-Z. If you are using the above mentioned processors and operating systems, and ran across some strange stability problems, try this hot fix patch.
By Convention, it will be integrated in the Windows 7/Server 2008 R2 SP2 upgrade package. KB2493989 patch for the address: http://support.microsoft.com/hotfix/KBHotfix.aspx?kbnum=2493989&kbln=en-us
Exposure of the latest Intel Desktop CPU roadmap-Intel,Sandy Bridge-E,Ivy Bridge
Also was the Turkey site of Donanimhaber news, latest exposure in Intel Desktop CPU product roadmap, Sandy Bridge-E platform will firmly occupy the high end product line until the third quarter of 2012.
Top of Core i7-3960X replacement of the original Core I7 990X location, Core i7-3960X core also has 6, the default frequency 3.33GHz, three-level caching 15M, through a Turbo Boost speed to 3.9GHz; four channel integrated controller supports DDR3-1333 memory, TDP to 135W while Donanimhaber website called Core i7-3980X is likely to be Intel\'s first eight-core desktop processor. However, as we\'ve reported before, X79 chipset dragged down the Sandy Bridge-E platform release, although the official release time of now or figure in the last quarter of 2011, but the motherboard chipset Patsburg-D degraded from the original plan for the Patsburg-A/B, with fewer SATA 6Gbps interface.
Sandy Bridge-E platform processor released Q4 first addition to the six-core Core i7-3960X includes six Core i7-3930K and quad-core Core I7-3820. Confirm Intel next generation 22nm process Ivy Bridge processors will be officially released March 2012 or April, first foray into LGA1155 high-end and mainstream consumer market. High-end market will be in 2012 after the third quarter and Sandy Bridge-E Ivy Bridge-E launches with the LGA2011 interface.