Intel plans to re-enter the radio component manufacturing after 10-Intel, Intel, re-enter the radio component manufacturing
On the promotion of digital technology, Intel is little rivals. This week, held in San Francisco, Intel ready to launch, disclosing key advances in radio component of the new design, in General, radio components using simulation technology and different material than the Silicon, silicon chip is used to manufacture.
Radio components available in the power amplifier (Power Amplifiers), signal transmission device, regulator, and other radio frequency components, collectively referred to as RF. Intel CTO Justin (Justin Rattner) said: “ we will introduce a competitive digital RF components, they are the key to the radio module.
” In 1965, Intel co-founder Moore made a “ &rdquo Moore;, it gives us a cheap and powerful microprocessors and memory chips, including laptops and mobile phones.
If the RF circuits on the same chip factory, unit costs drop like a processor of the year, 4G, Wi-Fi, and other components reducing the cost of data transmission on the network. In addition, the RF component can also be placed on the chip, space and energy saving, economical production cost of smartphones.
At the International Solid State Circuits Conference (International Solid-State Circuits Conference), Intel made a description, it is a chip that has Wi-Fi transceivers, two Atom processor core, put them on the same chip. Devices called “ SoC (System on chip) ”, on a mobile phone has become widely popular.
Most communication devices base band and traditional processors, you can have the device using the application software. However radio frequency component is actually used to adjust and expand the radio waves, are generally independent, Justin says is so, because it signals can interfere with other chips run part.
Intel\'s efforts to reduce the interference, which requires collaboration from a group of research and development, manufacturing engineer, found the right way. Finally, Intel found confidence, that can launch real products on a single chip, RF components above, can be used in mobile phones, tablets and other devices.
Justin says, these sizes, energy-saving products are very important, but he also acknowledged that progress still take years. However, Intel to invest billions of dollars building a factory to bet for the future, it is the production of the most advanced production technology, the most efficient.
But from the other side, logic chips are also efficient, profitable, exactly the opposite of them, by using the old falling manufacturing costs, using radio frequency available material, such as Silicon, factory is used for more than 10 years. Intel process is in question.
Justin\'s former lipate · the Kissinger (Patrick Gelsinger) 10 years ago has made a decision, cut “ Intel &rdquo wireless freedom, (Radio Free Intel) project. Justin says: “ back let them scratch their heads. &Amp;rdquo; he thought Kissinger on the manufacturing technology objectives have foresight, but underestimate the time and effort. He said: “ part of the past 10 years we have had better address the problem.
” In addition to the radio components, Intel ISSCC Conference also spoke of progress in other areas, is primarily used to reduce the energy consumption of the chip design. There is also a focus on the floating-point component of new design methods. (Text/Sohu IT)
