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21Feb/120

World record! Sony development 6.3Gbps millimeter-wave wireless communications technology – Sony, Tsukuba University of Technology, Tokyo Institute of Technology, 6.3Gbps, millimeter wave, wireless communications,

Sony Corporation today announced that Sony, Tsukuba University of Technology, Tokyo Institute of Technology, three joint, developed a new type of wireless RF LSI and the BB the LSI baseband and millimeter-wave wireless communications can achieve speeds of up to 6.3Gbps, a new world record.In recent years, wireless communication speed needs rapid increases in desire for increasingly high frequencies, particularly the more critical is the shortage of frequencies below 6GHz, towards high-definition levels of addition, as the quality of the pictures, music, video, data traffic between the devices is also a rapid increase have put a higher demand on the large amount of data transmission speed between devices.To this end, Sony and Japan's top two universities to develop this millimeter-wave wireless communications technologies to achieve high-speed, low power data transfer between mobile devices, people do not need the data cable will be able to send and receive large-scale data anytime, anywhere, while also uncompressed high quality video streaming from mobile devices to high-definition television and other display devices.Overall development of this joint project, Sony is responsible for designing the digital part of the BB LSI chip Sony rate-14/15 Low Density Parity Check (LDPC ECC) significantly reduced the error checking needed redundant data, the unit of bit energy efficiency up 11.8pj (skin Bajaur), 6.3Gbps speed, but 74mW (milliwatts). This LDPC check code has also been submitted to the 60GHz band millimeter-wave wireless communication standard for the IEEE 802.15.3c, and has been adopted.Tokyo Institute of Technology has designed the digital part of the BB LSI and RF the LSI, which can be used as a 60GHz band millimeter-wave direct conversion transceiver for the first time in the 60GHz frequency band for each frequency channel (four total) to achieve 16QAM (quadrature amplitude modulation). Power consumption of the BB in the LSI on the analog-to-digital converter (ADC) to achieve the lowest in the world, 2.3GS / s sampling rate, a mere 12mW.BB LSI chip using 40nm CMOS process, the length and width dimensions of only 3 mm. RF LSI chip using 65nm CMOS technology production, the length and width dimensions are 4.2 mm, the two together is about 26.6 mm2.System architecture diagramRF LSI, BB LSI chip chart

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